PROJECTS

Prufrock 2

  • Electromechanical integration of medium and low voltage system hardware
  • Mechanical system layout
  • Cabling and hydraulic routing
  • Custom machine and waterjet part design

PXIe-1090

  • Mechanical integration of industrial automation equipment
  • Cost optimized die cast, sheet metal, injection molded frame variants
  • Technical and part and development cost tradeoffs identified
  • Define product minimal viable product for new customer market
  • Mechanical product team lead
  • Lead designer on all parts
  • System assembly, sheet metal, injection molded plastic, cabling and harness
  • AC-DC power supply integration
  • Assembly and part drawing reviews (critical to function, key interfaces)
  • Responsible for system level form, fit function
  • Part and assembly tolerance analysis
  • PCBA mechanical input, layout and technical review multiple internal CCAs)
  • Works closely with digital and analog hardware engineering team to define V&V scope and test plan
  • PCBA and OTS part thermal validation
  • Shock and Vibration analysis
  • HALT
  • Part and assembly renders
  • Feedback loop with marketing and product ownership team
  • Mechanical schedule
  • Created and maintained mechanical and system level across multiple design and validation engineers
  • Tracked mechanical design and validation tasks and coordinated progress with multi-discipline team leads
  • System COGS
  • Part cost estimates in early design phase for different feature implementations
  • BOM and ECO management

PXIe-1095

  • Mechanical product team lead
  • Lead mechanical designer
  • System assembly, sheet metal, internal injection molded plastic, cabling and harness
  • Assembly and part drawing reviews (critical to function, key interfaces)
  • Responsible for system level form, fit function
  • Part and assembly tolerance analysis
  • Part first article validation (dimensional and cosmetic)
  • PCBA mechanical input, layout and technical review (3 internal CCAs)
  • Shared part design for subsequent chassis development (PXIe-1084, PXIe-1092)
  • Mechanical schedule
  • Created and maintained mechanical and system level development schedule for multiple variants.
  • Tracked mechanical design and validation tasks and coordinated progress with multi-discipline team leads
  • System COGS
  • Part cost estimates in early design phase for different feature implementations
  • Played key role in system cost reduction vs older variants
  • BOM and ECO management

PXIe-1095, PXIe-1092 Timing and Sync Option

  • Modular upgrade path for multiple chassis variant
  • Single PCBA and mechanical interface design
  • Field technician upgradable
  • High speed customer internal (PCIe Gen3) internal cabling
  • Modular mezzanine PCBA style design
  • Flexible mechanical architecture for upgraded or different I/O designs
  • High speed gen3 capable custom internal cabling
  • Early prototype paper dolls and thermal evaluation
  • Connector selection and I/O layout

NI XNET CAN Transceiver Cable

  • Interchangable extensible cable design with multiple CAN interfaces: High Speed, Low Speed, LIN
  • Modular cables share overmold on PCBA level design
  • New c-Series side interface connector selection
  • High voltage safety qualified
  • -40 to 70C operational
  • Custom test platform designed and validated with supplier
  • Created internal thermal architecture specifications for thermally dissipative cables
  • Passive dissipation architecture highly sensitive to low power applications
  • Size, shape, mounting location requirements tested and defined

NI-9860

  • NI c-Series automotive flexible CAN product
  • Industrial ethernet connector validation
  • PCBA mechanical layout and design:
  • Safety isolation
  • High density FPGA thermal evaluation
  • Custom overlay artwork

HDD-8266

  • High speed SAS storage drive ruggedization and validation
  • MXI (x4 PCIe link) extension device
  • Validated thermal and S&V to IEC 68-2-64 and IEC 68-2-27
  • Buy/resell parted evaluation with in house validation

RMC-8355

  • Validation of partnered design with custom hardware upgrades
  • Thermal validation of x64 architecture to match internal IEC 68-2-64 environmental requirements
  • Validation of server ruggedization to IEC 68-2-27
  • OTS hardware validation (Xeon, GPU, SSD, North/South bridge, power supplies, etc)
  • Custom hardware bracketing for ruggedization
  • Custom die cast handles
  • Product markings and overlay updates to match National Instruments branding
  • Paint/finish updates